3D integration technologies

DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2009, Pages 71-73

  Ramm, Peter ^a   Klumpp, Armin ^a   Weber, Josef ^a   Taklo, Maaike M V ^a,b  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b SINTEF   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3D PACKAGING; AUTOMOTIVE APPLICATIONS; BACK END OF LINES; COST-EFFECTIVE FABRICATION; E-CUBES; FABRICATED DEVICE; FABRICATION COST; ICV-SLID; INTERCONNECT PERFORMANCE; KEY SOLUTION; PREDICTED PERFORMANCE; TECHNOLOGY CHOICES; THERMO-MECHANICAL STRESS; THROUGH-SILICON-VIA;

FABRICATION; STRESSES; THREE DIMENSIONAL;

TECHNOLOGY;

EID: 70349202499     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. S. Arkalgud, "SEMATECH 3-D TSV Technology Development", Proc. International 3D System Integration Conference 3D-SIC 2008, Tokyo, Japan
2. International Technology Roadmap for Semiconductors (ITRS) http://www.public.itrs.net 2007 release
3. http://www.ecubes.org
4. P. Garrou, C. Bower, P. Ramm, Handbook of3D Integration. Wiley-VCH, 2008 (ISBN: 978-3-527-32034-9)
5. "3D IC, WLP and TSV Packaging Newsletter", I-micronews (Yole Developpement), http://www.imicronews.com 2008 May issue
6. P. Ramm, 1. Wolf, B. Wunderle, "Wafer-level 3D System Integration" in Handbook of3D Integration, Wiley-VCH, 2008
7. P. Ramm, 1. Wolf, A. Klumpp, R. Wieland, B. Wunderle, B. Michel, "Through Silicon Via Technology" Proc. 58th ECTC, Lake Buena Vista, FL, 2008
8. M. M. V. Taklo, N. Lietaer, H. Rosquist, T. Seppiinen, T. Herndl, 1. Weber and P. Ramm, "MEMS Sensor/IC integration for miniaturized TPMS (e-CUBES)", Proc. Sematech Workshop on Manufacturing and Reliability Challenges for 3D ICs Using TSVs, San Diego, CA, 2008