3D MEMS and IC integration

Materials Research Society Symposium Proceedings

Volumn 1112, Issue , 2009, Pages 211-220

  Taklo, M M V ^a   Lietaer, N ^a   Tofteberg, H R ^a   Seppanen, T ^b   Prainsack, J ^c   Weber, J ^d   Ramm, P ^d  

^a SINTEF   (Norway)

^b SensoNor AS   (Norway)

^c INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

^d Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3-D MEMS; 3D STACKING TECHNOLOGY; BULK-MICROMACHINED; DEEP REACTIVE ION ETCHING; DOPED SILICON; ENABLING TECHNOLOGIES; GOLD STUD BUMP; HIGH-VOLUME PRODUCTION; I/O COUNT; INTER-DIFFUSION; INTERMETALLIC COMPOUNDS; KEY PROCESS; MECHANICAL ASPECTS; MEMSDEVICES; MICRO-BUMPS; MICROELECTROMECHANICAL SYSTEMS; SMART SYSTEM; SOLID-LIQUID; STACK FORMATION; THROUGH SILICON VIAS; WIRELESS SENSOR NODE;

ELECTRIC NETWORK SYNTHESIS; GOLD; INTEGRATED CIRCUITS; INTERMETALLICS; MEMS; MICROELECTROMECHANICAL DEVICES; POLYSILICON; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SENSOR NODES; SENSORS; SILICON WAFERS; TECHNOLOGY; TELECOMMUNICATION EQUIPMENT; THREE DIMENSIONAL; WAFER BONDING;

INTEGRATION;

EID: 70449558965     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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