MEMS packaging and microassembly challenges

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3891, Issue , 1999, Pages 22-25

  Mehalso, Robert ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; ACTUATORS; MICROELECTRONICS; MICROPROCESSOR CHIPS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SENSORS; ASSEMBLY; MICROELECTRONIC PROCESSING;

MICROASSEMBLY; MICROFABRICATION;

MICROELECTROMECHANICAL DEVICES;

EID: 0033332365     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)