MEMS Packaging Solutions: Open New Markets

Electronic Packaging and Production

Volumn 40, Issue 6, 2000, Pages 49-58

  Gilleo, Ken ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001802883     PISSN: 00134945     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. Mignardi, M., "From ICs to DMDs," TI Technical Journal, pp. 56-63, July-Sept. 1998 (http://www.TI.com).
2. Miller, W. M., "MEMS Reliability and Testing," IMAPS Packaging of MEMS Microsystems Workshop, Chicago, Oct. 23-24, 1999.