Advanced testing and prognostics of ball grid array (BGA) components with a stand-alone monitor IC

AUTOTESTCON (Proceedings)

Volumn , Issue , 2009, Pages 184-189

  Bhatia, Anuj ^a   Hofmeister, James P ^a   Goodman, Douglas L ^a   Judkins, Justin B ^a  

^a Ridgetop Group Inc   (United States)

Author keywords

Ball grid array; BGA; CBM; Diagnostics; EHM; FPGA (field programmable gate array); Intermitten; Intermittencies; IVHM; Prognostics; Solder joint

Indexed keywords

BALL GRID ARRAY PACKAGES; CBM; CONDITION-BASED MAINTENANCE; DIGITAL ELECTRONICS; FPGA TESTING; HEALTH MANAGEMENT; INTERCONNECT DENSITIES; INTERMITTENCY; INTERMITTENT FAILURE; NO FAULT FOUND; SOLDER BALLS; SOLDER JOINTS; STAND -ALONE;

BALL GRID ARRAYS; DIGITAL DEVICES; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; LOGIC GATES; OPTICAL SENSORS; SPHERES;

FIELD PROGRAMMABLE GATE ARRAYS (FPGA);

EID: 72249109593     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AUTEST.2009.5314005     Document Type: Conference Paper

References (25)

1. J.P. Hofmeister, P. Lall, D. Goodman, E.O. Ortiz, M.G.P. Adams, and T.A. Tracy, "Intermittency Detection and Mitigation in Ball Grid Array (BGA) Packages," paper accepted for publishing in the proceedings of IEEE AUTOTESTCON 2007, Baltimore, MD, Sep.17-21, 2007.
2. J.P. Hofmeister, P. Lall and R. Graves, "In-Situ, Real-Time Detector for Faults In Solder Joint Networks Belonging to Operational, Fully Programmed Field Programmable Gate Arrays (FPGAs), IEEE Instrumentation and Measurement Magazine, Aug., 2007, pp. 32-37.
3. J.P. Hofmeister, P. Lall and Russ Graves, "In-Situ, Real-Time Detector for Faults in Solder Joints Belonging to Operational, Fully Programmed FPGAs," Proceedings, IEEE AUTOTESTCON 2006, Anaheim, CA, Sep. 18-21, 2006, pp-237-243.
4. th IEEE Electronic Components and Technology Conference, June 1, 2007.
5. James P. Hofmeister, Pradeep Lall, Edgar Ortiz, Jeremy Ralston-Good, and Douglas Goodman, "Prognostic Solder Joint Sensors for Programmed FPGAs," CMSE Conference 2007, Components Technology Institute, Inc., Los Angeles, CA., Mar. 12-15, 2007, pp. 159-68.
6. James P. Hofmeister, Pradeep Lall, Edgar Ortiz, Doug Goodman and Justin Judkins, "Real-Time Detection of Solder-Joint Faults in Operational Field Programmable Gate Arrays," IEEE Aerospace Conference 2007, Big Sky, MT, Mar. 4-9, 2007, Track 11-0908, pp. 1-9.
7. Accelerated Reliability Task IPC-SM-785, SMT Force Group Standard, Product Reliability Committee of the IPC, Published by Analysis Tech., Inc., 2005, www.analysistech.com/event-tech-IPC-SM-785.
8. P. Lall, M.N. Islam, N. Singh, J.C. Suhling and R. Darveaux, "Model for BGA and CSP Reliability in Automotive Underhood Applications," IEEE Trans. Comp. and Pack. Tech.,Vol. 27, No. 3, Sep. 2004, pp. 585-593.
9. R. Gannamani, V. Valluri, Sidharth and M-L Zhang, "Reliability evaluation of chip scale packages," Advanced Micro Devices, Sunnyvale, CA, in Daisy Chain Samples, Application Note, Spansion, July 2003, pp. 4-9.
10. Sony Semiconductor Quality and Reliability Handbook, Revised May 2001, http://www.sony.net/products/SC-HP/tec/catalog, Vol. 2, pp. 66-67, Vol. 4, pp. 120-129.
11. Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages, SEMATECH Technology Transfer #99083813A-XFR, International SEMATECH, 1999, pg. 6.
12. Comparison of Ball Grid Array (BGA) Component and Assembly Level Qualification Tests and Failure Modes, SEMATECH Technology Transfer #00053957A-XFR, International SEMATECH, May 31, 2000, pp. 1-4.
13. R. Roergren, P-E. Teghall and P. Carlsson, "Reliability of BGA Packages in an Automotive Environment," IVF-The Swedish Institute of Production Engineering Research, Argongatan 30, SE-431 53 Moelndal, Sweden, http://www.ivf.se, accessed Dec. 25, 2005.
14. D.E. Hodges Popp, A. Mawer and G. Presas, "Flip chip PBGA solder joint reliability: power cycling versus thermal cycling," Motorola Semiconductor Products Sector, Austin, TX, Dec. 19, 2005.
15. The Reliability Report, XILINX, xgoogle.xilinx.com, Sep. 1, 2003, pp. 225-229.
16. th ECTC, Washington, D.C., May 1-4, 1994, pp. 487-497.
17. th IEEE Electronic Components and Technology Conference, San Diego, California, pp. 85-94, May 30-June 2, 2006.
18. th IEEE Electronic Components and Technology Conference, San Diego, California, pp.718-727, May 30-June 2, 2006.
19. P. Lall, N. Islam and J. Suhling, "Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments," Proceedings of the ASME InterPACK Conference, San Francisco, CA, Paper IPACK2005-73426, pp. 1-9, July 17-22, 2005.
20. P. Lall, M.N. Islam, K. Rahim and J. Suhling, "Prognostics and Health Management of Electronic Packaging," Accepted for Publication in IEEE Transactions on Components and Packaging Technologies, Paper Available in Digital Format on IEEE Explore, pp. 1-12, March 2005.
21. P. Lall, "Challenges in Accelerated Life Testing," Inter Society Conf., Thermal Phenomena, 2004, pg. 727.
22. XILINX Fine-Pitch BGA (FG1156/FGG1156) Package, PK039 (v1.2), June 25, 2004.
23. R.R Tummala, EJ. Rymaszewski and A.G. Klopfenstein, Ed., Microelectronics Packaging Handbook, Semiconductor Packaging Part II, Kluwer Academic Publishers, 2nd Ed., 1999, Vol. II, pp. 62-185.
24. Strain diagram produced by Norman Roth, Daimler, as part of the HALT of Ridgetop test boards, Sep. 2007.
25. J.P. Hofmeister, D.Goodman, Justin Judkins,,Terry Tracy,P.Lall "A Low power sensor Design,SJ Monitor ,for Monitoring 24x7 the Health of BGA Solder Joints" paper accepted for publishing in the proceedings of IEEE AEROCONFERENCE 2008.