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Volumn , Issue , 2006, Pages 237-243

In-situ, real-time detector for faults in solder joint networks belonging to operational, fully programmed field programmabmle gate arrays (FPGAS)

Author keywords

[No Author keywords available]

Indexed keywords

BUILT-IN SELF TEST; CAPACITORS; FAULT DETECTION; FIELD PROGRAMMABLE GATE ARRAYS (FPGA); SOLDERED JOINTS;

EID: 43549097875     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AUTEST.2006.283644     Document Type: Conference Paper
Times cited : (16)

References (17)
  • 1
    • 43549096495 scopus 로고    scopus 로고
    • Accelerated Reliability Task IPC-SM-785, SMT Force Group Standard, Product Reliability Committee of the IPC, Published by Analysis Tech., Inc., 2005, www.analysistech.com/event-tech-IPC-SM-785.
    • Accelerated Reliability Task IPC-SM-785, SMT Force Group Standard, Product Reliability Committee of the IPC, Published by Analysis Tech., Inc., 2005, www.analysistech.com/event-tech-IPC-SM-785.
  • 2
  • 3
    • 43549104987 scopus 로고    scopus 로고
    • R. Gannamani, V. Valluri, Sidharth and M-L Zhang, Reliability evaluation of chip scale packages, Advanced Micro Devices, Sunnyvale, CA, in Daisy Chain Samples, Application Note, Spansion, July 2003, pp. 4-9.
    • R. Gannamani, V. Valluri, Sidharth and M-L Zhang, "Reliability evaluation of chip scale packages," Advanced Micro Devices, Sunnyvale, CA, in Daisy Chain Samples, Application Note, Spansion, July 2003, pp. 4-9.
  • 4
    • 43549103857 scopus 로고    scopus 로고
    • Sony Semiconductor Quality and Reliability Handbook, Revised May 2001, http://www.sony.net/products/SC-HP/tec/catalog, 2, pp. 66-67, 4, pp. 120-129.
    • Sony Semiconductor Quality and Reliability Handbook, Revised May 2001, http://www.sony.net/products/SC-HP/tec/catalog, Vol. 2, pp. 66-67, Vol. 4, pp. 120-129.
  • 5
    • 43549085362 scopus 로고    scopus 로고
    • Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages, SEMATECH Technology Transfer #99083813A-XFR, International SEMATECH, 1999, 6.
    • Use Condition Based Reliability Evaluation: An Example Applied to Ball Grid Array (BGA) Packages, SEMATECH Technology Transfer #99083813A-XFR, International SEMATECH, 1999, pg. 6.
  • 6
    • 43549104083 scopus 로고    scopus 로고
    • Comparison of Ball Grid Array (BGA) Component and Assembly Level Qualification Tests and Failure Modes, SEMATECH Technology Transfer #00053957A-XFR, International SEMATECH, May 31, 2000, pp. 1-4.
    • Comparison of Ball Grid Array (BGA) Component and Assembly Level Qualification Tests and Failure Modes, SEMATECH Technology Transfer #00053957A-XFR, International SEMATECH, May 31, 2000, pp. 1-4.
  • 9
    • 43549117556 scopus 로고    scopus 로고
    • The Reliability Report, XILINX, xgoogle.xilinx.com, Sep. 1, 2003, pp. 225-229.
    • The Reliability Report, XILINX, xgoogle.xilinx.com, Sep. 1, 2003, pp. 225-229.
  • 13
    • 32844459679 scopus 로고    scopus 로고
    • Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments
    • San Francisco, CA, Paper IPACK2005-73426, pp, July 17-22
    • P. Lall, N. Islam and J. Suhling, "Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments," Proceedings of the ASME InterPACK Conference, San Francisco, CA, Paper IPACK2005-73426, pp. 1-9, July 17-22, 2005.
    • (2005) Proceedings of the ASME InterPACK Conference , pp. 1-9
    • Lall, P.1    Islam, N.2    Suhling, J.3
  • 14
    • 34548779748 scopus 로고    scopus 로고
    • Prognostics and Health Management of Electronic Packaging
    • Accepted for Publication in, Paper Available in Digital Format on IEEE Explore, pp, March
    • P. Lall, M.N. Islam, K. Rahim and J. Suhling, "Prognostics and Health Management of Electronic Packaging," Accepted for Publication in IEEE Transactions on Components and Packaging Technologies, Paper Available in Digital Format on IEEE Explore, pp. 1-12, March 2005.
    • (2005) IEEE Transactions on Components and Packaging Technologies , pp. 1-12
    • Lall, P.1    Islam, M.N.2    Rahim, K.3    Suhling, J.4
  • 16
    • 43549089107 scopus 로고    scopus 로고
    • FPGA I/O Buffer shown was taken from documentation for an Altera FPGA development kit, May
    • FPGA I/O Buffer shown was taken from documentation for an Altera FPGA development kit, May, 2006.
    • (2006)
  • 17
    • 43549118463 scopus 로고    scopus 로고
    • XILINX Fine-Pitch BGA (FG1156/FGG1156) Package, PK039 (v1.2), June 25, 2004.
    • XILINX Fine-Pitch BGA (FG1156/FGG1156) Package, PK039 (v1.2), June 25, 2004.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.