Electrodeposition of Sn-Ag-Cu alloys

Denki Kagaku

Volumn 65, Issue 12, 1997, Pages 1102-1106

  Arai, Susumu ^a   Kaneko, Norio ^b  

^a Precision Technology Research Institute of Nagano Prefecture   (Japan)

^b SHINSHU UNIVERSITY   (Japan)

Author keywords

Electrodeposition; Non cyanide Bath; Pb free Solder; Sn Ag Cu Alloy

Indexed keywords

EID: 0142077870     PISSN: 03669297     EISSN: None     Source Type: Journal    
DOI: 10.5796/kogyobutsurikagaku.65.1102     Document Type: Article

References (3)

1. Iver E. Anderson, 96 Nepcon West Proceeding, 882 (1996).
2. S. Arai and T. Watanabe, 93th Annual Meeting of the Surface Finishing Society of Japan, Abstr. 22 C-22 (1996).
3. Denkimekkikennkyuukai, (Ed., Mekki-Kyohon,) Nikkan Kogyo Shinbunsha, Tokyo, p. 71 (1995).