Recent advances on chip-to-chip optical interconnect

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7516, Issue , 2009, Pages

  Lu, Daniel ^a  

^a Henkel Corporation Electronic Materials   (China)

Author keywords

Chip to chip; Optical interconnect; Passive optical alignment

Indexed keywords

COMPUTATIONAL BANDWIDTH; CU INTERCONNECT; HIGH BANDWIDTH; HIGH BANDWIDTH COMMUNICATION; LENGTH SCALE; LOW COSTS; OFF-CHIP; ON CHIPS; OPTICAL ALIGNMENTS; OPTICAL INTERCONNECT; SENSITIVE APPLICATION; SHORT DISTANCES;

ALIGNMENT; BANDWIDTH; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTROOPTICAL DEVICES; INTEGRATED CIRCUITS; INTEGRATED OPTICS; OPTICAL INSTRUMENTS; OPTOELECTRONIC DEVICES; TELECOMMUNICATION SYSTEMS;

OPTICAL INTERCONNECTS;

EID: 71549120726     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.845081     Document Type: Conference Paper

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