Self-alignment of optical devices with fiber for low-cost optical interconnect modules

IEEE Photonics Technology Letters

Volumn 20, Issue 3, 2008, Pages 193-195

  Suzuki, Atsushi ^a   Wakazono, Yoshitsugu ^a   Nagao, Daisuke ^a   Ishikawa, Takaaki ^a   Hino, Tomoyuki ^a   Hashimoto, Youichi ^a   Masuda, Hiroshi ^a   Suzuki, Shuji ^a   Tamura, Mitsuaki ^a   Suzuki, Tei Ichi ^a   Kikuchi, Katsuya ^a   Nakagawa, Hiroshi ^a   Okada, Yoshikuni ^a   Aoyagi, Masahiro ^a   Mikawa, Takashi ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Liquid adhesive; Optical fibers; Optical interconnections; Self alignment; Surface tension; Vertical cavity surface emitting laser (VCSEL)

Indexed keywords

ADHESIVES; MULTIMODE FIBERS; OPTICAL FIBERS; OPTICAL INTERCONNECTS; PULSE MODULATION; SURFACE TENSION;

LIQUID ADHESIVE; SELF-ALIGNMENT PROCESS;

SURFACE EMITTING LASERS;

EID: 39549108711     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2007.913243     Document Type: Article

References (11)

1. L. A. B. Windover, J. N. Simon, S. A. Rosenau, K. S. Giboney, G. M. Flower, L. W. Mirkarimi, A. Grol, B. Law, C.-K. Lin, A. Tandon, R. W. Gruhlke, H. Xia, G. Rankin, M. R. T. Tan, and D. W. Dolfi, "Parallel-optical interconnects > 100 Gb/s," J. Lightw. Technol. vol. 22, no. 9, pp. 2055-2063, Sep. 2004.
2. B. J. Offrein, C. Berger, R. Beyeler, R. Dangel, L. Dellmann, F. Horst, T. Lamprecht, N. Meier, and J. Kash, "High bandwidth board-level parallel optical interconnects for server applications," in Proc. 32nd Eur. Conf. Opt. Commun., Cannes, France, Sep. 2006, Paper We.4.2.1.
3. A. F. Benner, M. Ignatowski, J. A. Kash, D. M. Kuchta, and M. B. Ritter, "Exploitation of optical interconnects in future server architectures," IBM J. Res. Develop., vol. 49, no. 4/5, pp. 755-775, Jul./Sep. 2005.
4. A. Suzuki, K. Suzuki, Y. Wakazono, S. Suzuki, T. Yamaguchi, H. Masuda, K. Saito, M. Kinoshita, O. Ibaragi, K. Kikuchi, H. Nakagawa, Y. Okada, and M. Aoyagi, "Low-cost and high-density 10 Gbps/ch optical parallel link module for multi-terabit router application," in Proc. 32nd Eur. Conf. Opt. Commun., Cannes, France, Sep. 2006, Paper We.4.2.3.
5. A. Avital and E. Zussman, "Fluidic assembly of optical components," IEEE Trans. Adv. Packag., vol. 29, no. 4, pp. 719-724, Nov. 2006.
6. J.-M. Kim, K. Yasuda, and K. Fujimoto, "Resin self-alignment processes for self-assembly systems," Trans. ASME J. Electron. Packag., vol. 127, no. 1, pp. 18-24, Mar. 2005.
7. K. Sato, K. Ito, S. Hata, and A. Shimokohbe, "Self-alignment of microparts using liquid surface tension-behavior of micropart and alignment characteristics," Precis. Eng., vol. 27, no. 1, pp. 42-50, Jan. 2003.
8. M. Kaneda, M. Yamamoto, K. Nakaso, T. Yamamoto, and J. Fukai, "Oscillation of a tilted circular pad on a droplet for the self-alignment process," Precis. Eng., vol. 31, no. 2, pp. 177-184, Apr. 2003.
9. Y. Wakazono, A. Suzuki, D. Nagao, T. Ishikawa, T. Hino, Y. Hashimoto, H. Masuda, S. Suzuki, M. Tamura, T. Suzuki, K. Kikuchi, H. Nakagawa, M. Aoyagi, and T. Mikawa, "A study on coupling efficiency between VCSEL and 45°-angled mirror component for low-cost and high-density 10 Gbps/ ch optical parallel link module," in Proc. 20th Annu. Meeting IEEE Lasers Electro-Optics Soc., Lake Buena Vista, FL, 2007, pp. 678-679, Paper WEE6.
10. L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosener, C. K. Tsang, C. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bout, M. R. T. Tan, and D. W. Dolfi, "Terabus: Terabit/Second-Class card-level optical interconnect technologies," IEEE J. Sel. Topics Quantum Electron., vol. 12, no. 5, pp. 1032-1044, Sep./Oct. 2006.
11. T. Mikawa, M. Kinoshita, K. Hiruma, T. Ishitsuka, M. Okabe, S. Hiramatsu, H. Furuyama, T. Matsui, K, Kumai, O. Ibaragi, and M. Bonkohara, "Implementation of active interposer for high-speed and low-cost chip level optical interconnects," IEEE J. Sel. Topics Quantum Electron., vol. 9, no. 2, pp. 452-459, Mar. 2003.