Passive alignment method of polymer PLC devices by using a hot embossing technique

IEEE Photonics Technology Letters

Volumn 16, Issue 7, 2004, Pages 1664-1666

  Kim, Jin Tae ^a   Yoon, Keun Byoung ^a   Choi, Choon Gi ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

HOT EMBOSSING TECHNIQUE; PASSIVE ALIGNMENT METHOD; POLYMER PLANAR LIGHTWAVE CIRCUIT; SELF ASSEMBLED MONOLAYERS; SILICON OPTICAL BENCH;

FLIP CHIP DEVICES; OPTICAL FIBER COUPLING; OPTICAL WAVEGUIDES; POLYMETHYL METHACRYLATES; REFRACTIVE INDEX; SCANNING ELECTRON MICROSCOPY; SELF ASSEMBLY; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SINGLE MODE FIBERS; THIN FILM CIRCUITS;

INTEGRATED OPTOELECTRONICS;

EID: 4344584023     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2004.828355     Document Type: Article

References (8)

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