Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5716, Issue , 2005, Pages 19-25

  Oppermann, Hermann ^a   Hutter, Matthias ^a   Engelmann, Gunter ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Au Sn; AuSn; Bumping; Flip chip; Fluxless; Mechanical stops; Optoelectronic; Passive alignment; Self alignment; Solder

Indexed keywords

AU-SN; AU-SN SOLDER; BUMPING; FLIP CHIP; FLUXLESS; MECHANICAL STOPS; OPTOELECTRONIC; PASSIVE ALIGNMENT; SELF-ALIGNMENT;

ALIGNMENT; ASSEMBLY; ELECTRONICS PACKAGING; NETWORKS (CIRCUITS); OPTOELECTRONIC DEVICES; SEMICONDUCTOR LASERS; SOLDERING; SURFACE TENSION;

FLIP CHIP DEVICES;

EID: 21844473775     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.600798     Document Type: Conference Paper

References (6)

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