Wafer level fabrication of high performance MEMS using bonded and thinned bulk piezoelectric substrates

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 849-852

  Aktakka, E E ^a   Kim, H ^a   Najafi, K ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Actuators; Lapping; Parylene bonding; Piezoelectric; PZT; Sensors; Solder bonding

Indexed keywords

AT RESONANCE; BULK PIEZOELECTRIC MATERIAL; FABRICATION TECHNOLOGIES; HYSTERESIS MEASUREMENTS; LOW TEMPERATURES; MASK FABRICATION; MEMSDEVICES; OUT-OF-PLANE; PARYLENE BONDING; PEAK-TO-PEAK DEFLECTION; PIEZOELECTRIC PROPERTY; PIEZOELECTRIC SUBSTRATES; POWER CONSUMPTION; PZT; PZT FILM; PZT SENSORS; SI WAFER; SOLDER BONDING; TEST RESULTS; WAFER-LEVEL FABRICATION;

DIAPHRAGMS; FABRICATION; LAPPING; MASKS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; PIEZOELECTRIC MATERIALS; PIEZOELECTRIC TRANSDUCERS; PIEZOELECTRICITY; SEMICONDUCTING LEAD COMPOUNDS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SOLID-STATE SENSORS; WAFER BONDING;

PIEZOELECTRIC ACTUATORS;

EID: 71449099113     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285795     Document Type: Conference Paper

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