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Volumn 15, Issue 10, 2005, Pages 1947-1955

Fabrication and performance of a flextensional microactuator

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; HYSTERESIS; MICROMACHINING; PIEZOELECTRIC MATERIALS; SILICON; THERMAL EFFECTS;

EID: 24644455978     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/10/022     Document Type: Review
Times cited : (15)

References (29)
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  • 2
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    • An active guide wire with shape memory alloy bending actuator fabricated by room temperature process
    • Mineta T et al 2002 An active guide wire with shape memory alloy bending actuator fabricated by room temperature process Sensors Actuators A 97-98 632-7
    • (2002) Sensors Actuators , vol.97-98 , Issue.1-2 , pp. 632-637
    • Mineta, T.1    Al, E.2
  • 3
    • 0036544233 scopus 로고    scopus 로고
    • Modeling of an electrostatic torsional actuator demonstrated with an RF MEMS
    • Sattler R et al 2002 Modeling of an electrostatic torsional actuator demonstrated with an RF MEMS Sensors Actuators A 97-98 337-46
    • (2002) Sensors Actuators , vol.97-98 , Issue.1-2 , pp. 337-346
    • Sattler, R.1    Al, E.2
  • 4
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    • Design, optimization, and simulation on microelectromagnetic pump
    • Gong Q et al 2000 Design, optimization, and simulation on microelectromagnetic pump Sensors Actuators A 83 200-7
    • (2000) Sensors Actuators , vol.83 , Issue.1-3 , pp. 200-207
    • Gong, Q.1    Al, E.2
  • 5
    • 0036225740 scopus 로고    scopus 로고
    • Fundamental limits on energy transfer and circuit considerations for piezoelectric transformers
    • Flynn A M and Sanders S R 2002 Fundamental limits on energy transfer and circuit considerations for piezoelectric transformers IEEE Trans. Power Electron. 17 8-14
    • (2002) IEEE Trans. Power Electron. , vol.17 , Issue.1 , pp. 8-14
    • Flynn, A.M.1    Sanders, S.R.2
  • 9
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    • Tin-based solder bonding for MEMS fabrication and packaging applications
    • Goyal A, Cheong J and Tadigadapa S 2004 Tin-based solder bonding for MEMS fabrication and packaging applications J. Micromech. Microeng. 14 819-25
    • (2004) J. Micromech. Microeng. , vol.14 , Issue.6 , pp. 819-825
    • Goyal, A.1    Cheong, J.2    Tadigadapa, S.3
  • 12
    • 0035399053 scopus 로고    scopus 로고
    • Piezoelectric actuation: State of the art
    • Niezrecki C et al 2001 Piezoelectric actuation: state of the art Shock Vib. Dig. 33 269-80
    • (2001) Shock Vib. Dig. , vol.33 , pp. 269-280
    • Niezrecki, C.1    Al, E.2
  • 13
    • 0042842361 scopus 로고    scopus 로고
    • Lead zirconate titanate-based piezoelectric micromachined switch
    • Gross S J et al 2003 Lead zirconate titanate-based piezoelectric micromachined switch Appl. Phys. Lett. 83 174-6
    • (2003) Appl. Phys. Lett. , vol.83 , Issue.1 , pp. 174-176
    • Gross, S.J.1    Al, E.2
  • 15
    • 0029338808 scopus 로고
    • Metal-ceramic composite transducer, the Moonie
    • Onitsuka K et al 1995 Metal-ceramic composite transducer, the Moonie J. Intell. Mater. Syst. Struct. 6 447-55
    • (1995) J. Intell. Mater. Syst. Struct. , vol.6 , Issue.4 , pp. 447-455
    • Onitsuka, K.1    Al, E.2
  • 19
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    • D31 Type inplane bending multilayer pieozoelctric microactuators-a design concept and its applications
    • Wang Z, Zhu W and Yao X 2002 d31 Type inplane bending multilayer pieozoelctric microactuators-a design concept and its applications Sensors Actuators A 101 262-8
    • (2002) Sensors Actuators , vol.101 , Issue.3 , pp. 262-268
    • Wang, Z.1    Zhu, W.2    Yao, X.3
  • 20
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    • Applications of high-performance MEMS pressure sensors based on dissolved wafer process
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    • Cheong J 2005 Design, fabrication, modeling, and experimental testing of a piezoelectric flextensional microactuator PhD Thesis Department of Mechnical and Nuclear Engineering, The Pennsylvania State University, University Park
    • (2005) PhD Thesis
    • Cheong, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.