Bonding of bulk piezoelectric material to silicon using a gold-tin eutectic bond

Materials Research Society Symposium - Proceedings

Volumn 687, Issue , 2002, Pages 49-54

  Turner, Kevin T ^a   Mlcak, Richard ^a   Roberts, David C ^a   Spearing, S Mark ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; HEATING; INTERFACES (MATERIALS); MICROELECTROMECHANICAL DEVICES; PRESSURE; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; SOLDERING ALLOYS; SPUTTER DEPOSITION; TENSILE TESTING; TITANIUM;

BOND CROSS-SECTIONS; ELECTRICALLY CONDUCTIVE BONDS; POLYCRYSTALLINE LEAD-ZIRCONATE TITANATE;

PIEZOELECTRIC MATERIALS;

EID: 0036350297     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)