Advanced heterogeneous integration of InP HBT and CMOS Si technologies for high performance mixed signal applications

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2009, Pages 1109-1112

  Gutierrez Aitken, Augusto ^a   Chang Chien, Patty ^a   Phan, Wen ^a   Scott, Dennis ^a   Oyama, Bert ^a   Sandhu, Randy ^a   Zhou, Joe ^a   Nam, Peter ^a   Hennig, Kelly ^a   Parlee, Matthew ^a   Poust, Ben ^a   Thai, Khanh ^a   Geiger, Craig ^a   Oki, Aaron ^a   Kagiwada, Reynold ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Analog digital conversion; CMOSFETs; Heterogeneous integration; Heterojunction bipolar transistors

Indexed keywords

ANALOG-DIGITAL CONVERSION; CMOS WAFERS; CMOSFETS; COMPOUND SEMICONDUCTORS; DARPA PROGRAM; DYNAMIC RANGE; HETEROGENEOUS INTEGRATION; II-IV SEMICONDUCTORS; INP-HBT; MIXED SIGNAL APPLICATIONS; NORTHROP GRUMMAN SPACE TECHNOLOGIES; SCALE INTEGRATION; SI TECHNOLOGY;

BIPOLAR TRANSISTORS; CMOS INTEGRATED CIRCUITS; ELECTRIC CONVERTERS; HETEROJUNCTIONS; INSULATING MATERIALS; INTEGRATION; MICROWAVES; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

HETEROJUNCTION BIPOLAR TRANSISTORS;

EID: 70549098752     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2009.5165895     Document Type: Conference Paper

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