Demonstration of a low loss W-band interconnect and circuit isolation structure for wafer scale assembly

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2007, Pages 1641-1644

  Farkas, David S ^a   Luna, Tony ^a   Chang Chien, Patty P ^a   Tornquist, Kelly ^a   Fordham, Owen ^a   Tsai, Roger ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Interconnections; Millimeter wave circuits; MMICs; Multichip modules; Wafer bonding; Wafer scale integration

Indexed keywords

FREQUENCY BANDS; INSERTION LOSSES; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; WAFER BONDING;

CHANNELIZATION; MILLIMETER WAVE CIRCUITS; WSA INTERCONNECTS;

WSI CIRCUITS;

EID: 34748850713     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2007.380002     Document Type: Conference Paper

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