Study of package warp behavior for high-performance flip-chip BGA

Microelectronics Reliability

Volumn 43, Issue 3, 2003, Pages 465-471

  Sawada, Yuko ^a   Harada, Kozo ^a   Fujioka, Hirofumi ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; LAMINATES; LOGIC DEVICES; LSI CIRCUITS; RESINS; SOLDERING; THERMAL EXPANSION; VISCOELASTICITY;

BALL GRID ARRAYS (BGA);

FLIP CHIP DEVICES;

EID: 0037371619     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00294-9     Document Type: Conference Paper

References (5)

1. Lau JH. Effects of underfill material properties on the reliability of solder bumped flip chip board with imperfect underfill encapsulants. In: Proceedings of the 1999 Electronic Components and Technology Conference (ECTC), San Diego, California, 1-4 June 1999. p. 571-82.
2. Qian Z. Fatigue life prediction of flip-chip in terms of nonlinear behaviors of solder and underfill. In: Proceedings of the 1999 Electronic Components and Technology Conference (ECTC), San Diego, California, 1-4 June 1999. p. 141-8.
3. Kaga Y. Thermal fatigue assessment for solder joints of underfill assembly. EEP-Vol. 26-1. Advances in electronic packaging. vol. 1:1999;ASME.
4. Murakami Gen Optimum design of elastomeric structure of CSP-μ BGA with thermo-viscoelastic analysis. J. Inst. Electron. Packag. 3(1):2000.
5. Baba S. Flip-chip BGA applied high-density organic substrate. In: Proceedings of the 1999 Electronic Component and Technology Conference (ECTC), San Diego, California, 1-4 June 1999. p. 243-9.