Versatile MEMS and MEMS integration technology platforms for cost effective MEMS development

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Pieters, Philip ^a  

^a IMEC   (Belgium)

Author keywords

MEMS integration; MEMS packaging; photonics; Post CMOS MEMS; RF MEMS

Indexed keywords

COST EFFECTIVE; INTEGRATION TECHNOLOGIES; MEMS DEVELOPMENT; MEMS PACKAGING; MEMS TECHNOLOGY; MEMSDEVICES; POST-CMOS; PROTOTYPING; RF-MEMS; SMALL-VOLUME PRODUCTION; TECHNOLOGY DEVELOPMENT;

COST EFFECTIVENESS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; PACKAGING; TECHNOLOGICAL FORECASTING; TECHNOLOGY;

MEMS;

EID: 70449786959     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

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