CMOS-integrated stress sensor systems for mechanical sensing and packaging reliability testing

Materials Research Society Symposium Proceedings

Volumn 1139, Issue , 2009, Pages 201-209

  Paul, Oliver ^a   Gieschke, Pascal ^a   Lemke, Benjamin ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR TECHNOLOGIES; DEVELOPED APPLICATIONS; EXPERIMENTAL SETUP; FOUR-DEGREES-OF-FREEDOM; FOUR-POINT BENDING; IN-PLANE STRESS; MECHANICAL CONSTRAINTS; MECHANICAL SENSING; MECHANICAL STRESS; OUT-OF-PLANE; RELIABILITY TESTING; STRESS SENSOR; TACTILE SENSORS; THERMO-MECHANICAL; TIME-DEPENDENT; VERTICAL STRESS;

MEMS; METALLIC COMPOUNDS; MICROELECTROMECHANICAL DEVICES; MOS DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE; SOLID-STATE SENSORS;

STRESSES;

EID: 70449585531     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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