Joule heating effects on electromigration in Cu/low-κ interconnects

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2009, Pages 837-843

  Yokogawa, S ^a   Kakuhara, Y ^a   Tsuchiya, H ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

1 D radiation; 2 D radiation; Cu low k; Electromigration; Joule heating; Pulse stress

Indexed keywords

1-D RADIATION; 2-D RADIATION; CU/LOW-K; DENSE STRUCTURES; HIGH-FREQUENCY PULSE; JOULE HEATING EFFECT; LIFETIME DEGRADATION; PULSE STRESS;

ELECTROMIGRATION; HEATING; JOULE HEATING;

RADIATION;

EID: 70449105969     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IRPS.2009.5173362     Document Type: Conference Paper

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