Electromigration reliability of damascene copper interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 259-269

  Yokogawa, Shinji ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DAMASCENE COPPER INTERCONNECTS; ELECTROMIGRATION RELIABILITY; KAWASAKI-HU TEST STRUCTURE; PULSED CURRENT STRESS;

ACTIVATION ENERGY; COPPER; CURRENT DENSITY; DIFFUSION; ELECTROMIGRATION; LSI CIRCUITS;

OPTICAL INTERCONNECTS;

EID: 23844432932     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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