Contactless testing: Possibility or pipe-dream?

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2009, Pages 676-681

  Marinissen, Erik Jan ^a   Dae, Young Lee ^b   Hayes, John P ^b   Sellathamby, Chris ^c   Moore, Brian ^c   Slupsky, Steven ^c   Pujol, Laurence ^d  

^a IMEC   (Belgium)

^b UNIVERSITY OF MICHIGAN   (United States)

^c Scanimetrics Inc   (Canada)

^d Beamind   (France)

Author keywords

[No Author keywords available]

Indexed keywords

PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; SILICON COMPOUNDS; SYSTEM-IN-PACKAGE; THREE DIMENSIONAL INTEGRATED CIRCUITS;

ASSEMBLY TECHNIQUES; CONTACT LESS; ELECTRICAL CONTACTS; ELECTRONIC SYSTEMS; PIPE DREAMS; STATE OF THE ART; WIRELESS INTERFACES;

INTEGRATED CIRCUIT TESTING;

EID: 70350053132     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/date.2009.5090751     Document Type: Conference Paper

References (14)

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