High throughput non-contact SiP testing

Proceedings - International Test Conference

Volumn , Issue , 2007, Pages

  Moore, B ^a   Sellathamby, C ^a   Cauvet, P ^b   Fleury, H ^b   Paulson, M ^a   Reja, M ^a   Fu, L ^a   Bai, B ^a   Reid, E ^a   Filanovsky, I ^c   Slupsky, S ^a  

^a Scanimetrics Inc   (Canada)

^b NXP SEMICONDUCTORS   (France)

^c UNIVERSITY OF ALBERTA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNAS; CMOS INTEGRATED CIRCUITS; DATA TRANSFER; NATURAL FREQUENCIES; TRANSCEIVERS; WSI CIRCUITS;

ANTENNA STRUCTURES; NEAR FIELD COMMUNICATIONS; SYSTEM-IN-PACKAGE (SIP); WIRELESS TEST ACCESS PORT;

ELECTRONICS PACKAGING;

EID: 39749088278     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TEST.2007.4437595     Document Type: Conference Paper

References (17)