High-performance temporary adhesives for wafer bonding applications

Materials Research Society Symposium Proceedings

Volumn 970, Issue , 2007, Pages 239-249

  Puligadda, Rama ^a   Pillalamarri, Sunil ^a   Hong, Wenbin ^a   Brubaker, Chad ^b   Wimplinger, Markus ^b   Pargfrieder, Stefan ^b  

^a BREWER SCIENCE INC   (United States)

^b EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

MYRIAD STRUCTURES; POWER DEVICES; STACKING CHIPS; SUBSTRATE FLEXIBILITY;

ADHESIVES; ELECTRIC RESISTANCE; LITHOGRAPHY; PROGRAM PROCESSORS; SMART CARDS; SUBSTRATES;

WAFER BONDING;

EID: 34250794985     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. F. Niklaus., G. Stemme, J.Q. Lu, "Adhesive wafer bonding," J. Appl. Phys., 2006, 99, 031101.
2. J. Moore, A. Smith, D. Nguyen, S. Kulkarni, "High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing," MANTECH 2004, 8.10.
3. C. Brubaker, M. Wimplinger, A. Malzer, P. Lindner, "Advances in Processing of Compound Semiconductor Substrates," MANTECH 2005, p. 261.
4. S. Combe, J. Cullen, M. O'Keefe. "Reversible Wafer Bonding: Challenges in Ramping up 150mm GaAs Wafer Production to Meet Growing Demand," MANTECH 2006, p. 193.
5. Y. Kwon, J. Seok, "An evaluation process of polymeric adhesive wafer bonding for vertical system integration," Japanese Journal of Applied Physics, Part 1, vol. 44, no. 6A, 2005, pp. 3893-3902.