Evaluation of a module based memory system with an LCP flex interconnect

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1200-1206

  Kollipara, Ravi ^a   Li, Ming ^a   Mullen, Don ^a   Beyene, Wendemagegnehu ^a   Madden, Chris ^a   Yuan, Chuck ^a   Kusamitsu, Hideki ^b   Ito, Toshiyasu ^b  

^a RAMBUS INC   (United States)

^b Yamaichi Electronics Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOTTOM LAYERS; CSP PACKAGES; DATA RATES; DIFFERENTIAL PAIRS; GRID ARRAYS; MEMORY CONTROLLER; MEMORY MODULES; MEMORY SYSTEMS; MEMORY TESTS; MODULE-BASED; SOLDER BALLS; SYSTEM MARGIN; THROUGH HOLE;

AUTOMOBILE SEATS; INTEGRATED CIRCUITS; PRINTED CIRCUITS;

CONTROLLERS;

EID: 70349682159     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074164     Document Type: Conference Paper

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