Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers

Microelectronics Reliability

Volumn 46, Issue 5-6, 2006, Pages 850-858

  Yamashita, M ^a,b   Suganuma, K ^a  

^a OSAKA UNIVERSITY   (Japan)

^b INDUSTRIAL TECHNOLOGY CENTER OF WAKAYAMA PREFECTURE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; FILLERS; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); METALLURGY; MICROSTRUCTURE; PYROLYSIS; SILVER ALLOYS; SILVER PLATING; TENSILE TESTING; TIN ALLOYS;

CURING TIME; ISOTROPIC CONDUCTIVE ADHESIVES (ICA); METALLURGICAL CONNECTIONS;

COPPER;

EID: 33645144398     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.05.020     Document Type: Conference Paper

References (17)

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