Impact property evaluation of ag-epoxy conductive adhesive joint

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 78-83

  Kim, Do Seop ^a   Kang, Min ^a   Kim, Keun Soo ^a   Kim, Sun Sik ^a   Kim, Seong Jun ^a   Suganuma, Katsuaki ^a   Yu, Qiang ^b  

^a OSAKA UNIVERSITY   (Japan)

^b YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

Ag epoxy conductive adhesive; Impact strength; Shear strength; Sn 3Ag 05Cu solder; Void

Indexed keywords

CONDUCTIVE ADHESIVE; IMPACT PROPERTY; IMPACT TESTING MACHINES; MAXIMUM FORCES; NICKEL SUBSTRATES; PRINTING METHOD; SUBSTRATE MATERIAL; VOID;

ADHESIVE JOINTS; CONDUCTIVE MATERIALS; DIAMOND CUTTING TOOLS; IMPACT STRENGTH; IMPACT TESTING; MICROELECTRONICS; SHEAR STRENGTH; SILVER; SUBSTRATES;

TIN;

EID: 70349687870     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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