Impact resistance of SM joints formed with ICA

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 93-97

  Wu, C M Lawrence ^a   Li, Robert K Y ^a   Yeung, N H ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COMPUTER SIMULATION; IMPACT TESTING; LEAD ALLOYS; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; STRAIN RATE;

IMPACT BENDING TEST; ISOTROPIC CONDUCTIVE ADHESIVE; POST-IMPACT SHEAR STRENGTH; SURFACE MOUNT JOINTS;

SURFACE MOUNT TECHNOLOGY;

EID: 0344982106     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1534842     Document Type: Article

References (6)

1. Westphal, H., 1999, "Health and Environmental Aspects of Conductive Adhesives-The Use of Lead-Based Alloys Compared With Adhesives," Conductive adhesives for electronics packaging, ed., J. Liu, p. 416.
2. Kolsky, H., 1949, "An Investigation of the Mechanical Properties of Materials at Very High Strain Rates of Loading," Proc. Phys. Soc. London, Sect. B, 62, p. 767.
3. Liu, J. 1999, "Introduction to Conductive Adhesive Joining Technology," Conductive Adhesives for Electronics Packaging, ed. J. Liu, pp. 9-11.
4. Hamouda, A. M. S., and Hashmi, M. S. J., 1998, "Testing of Composite Materials at High Rates of Strain: Advances and Challenges," J. Mater. Process. Technol., pp. 327-336.
5. Karihaloo, B. L., Y. W. Mai, M. I. Ripley, and R. O. Ritchie, 1997, High Strain Rate Fracture and Impact Mechanics, Pergamon, Vol. 6, pp. 2743-2754.
6. Blazynski, T. Z., 1987, Materials at High Strain Rates, Elsevier Applied Science, London and New York, pp. 47-70.