Application of no-flow underfill for a reliable high performance flip chip flex BGA

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 425-431

  Teo, Poi Siong ^a   Lim, Sharon Pei Siang ^a   Chai, Tai Chong ^a   Iyer, Mahadevan K ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BANDWIDTH; FLIP CHIP DEVICES; OPTIMIZATION; RELIABILITY THEORY; SUBSTRATES; THERMAL CYCLING;

BALL GRID ARRAYS (BGA);

ELECTRONICS PACKAGING;

EID: 0036290686     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Recent advances in underfill technology for flip-chip, ball grid array, and chip scale package applications
2. Recent advances in the development of no-flow underfill encapsulants - A practical approach towards the actual manufacturing application
3. Incorporation of inorganic filler into the no-flow underfill material for flip-chip application
4. A novel approach for incorporating silica filler into no-flow underfill
5. Development of A flip-chip flex BGA package for high performance applications
6. Study on the correlation of flip-chip reliability with mechanical properties of no-flow underfill materials
7. Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials
8. A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly
9. Flip-chip assembly development via modified reflowable underfill process