Stability of AuSn eutectic solder cap on Au socket during reflow

Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 1, 2009, Pages 55-59

  Yu, D Q ^a,b   Oppermann, H ^a   Kleff, J ^a   Hutter, M ^a  

^a FRAUNHOFER IZM   (Germany)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER LAYERS; COMPOUND LAYERS; EUTECTIC ALLOYS; EUTECTIC SOLDERS; MULTIPLE REFLOW CYCLES; SIDE WALLS;

BRAZING; EUTECTICS; SOLDERING ALLOYS; TIN; WELDING;

GOLD;

EID: 58149115516     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-008-9606-4     Document Type: Article

References (8)

1. C. Kallmayer, D. Lin, J. Kloser, H. Oppermann, E. Zakel, H. Reichl, in 17th International Electronics Manufacturing Symposium, IEMT' 95 (Austin, Texas, 1995), p. 20
2. H. Oppermann, M. Hutter, M. Klein, G. Engelmann, M. Töpper, J. Wolf, Mater. Res. Soc. Symp. Proc. 863, B10.1.1 (2005)
3. H. Oppermann, G. Engelmann, E. Zahel, H. Reichl, in Proceedings of the Micro-System Technolgies-94 Conference (VDE, Berlin, 1994), p. 509
4. W. Pittroff, T. Reiche, J. Barnikow, A. Klein, U. Merkel, K. Vogel, J. Würfl, Appl. Phys. Lett. 67, 2367 (1995)
5. M. Hutter, H. Oppermann, G. Engelmann, J. Wolf, O. Ehrmann, R. Aschenbrenner, H. Reichl, in Proceedings of the 52nd Electronic Components and Technology Conference (San Diego, CA, 2002), p. 282
6. Z. Gu, H. Ye, D. Smirnova, D. Small, H. Gracias, Small 2, 225 (2006)
7. Y.T. Lai, C.Y. Liu, J. Eletron. Mater. 35, 28 (2005)
8. L. Yin, S.J. Meshter, T.J. Singler, Acta Mater. 52, 2873 (2004)