Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network

IEEE Transactions on Electromagnetic Compatibility

Volumn 51, Issue 3 PART 2, 2009, Pages 784-791

  Oo, Zaw Zaw ^a,b   Li, Er Ping ^a,b   Wei, Xing Chang ^a,b   Liu, En Xiao ^a   Zhang, Yao Jiang ^a   Li, Le Wei Joshua ^b  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Electronic package; Modal decomposition method; Power distribution network (PDN); Power integrity; Signal traces; Through hole vias

Indexed keywords

ELECTRONIC PACKAGE; MODAL DECOMPOSITION METHOD; POWER DISTRIBUTION NETWORK (PDN); POWER INTEGRITY; SIGNAL TRACES; THROUGH-HOLE VIAS;

COMPUTER SIMULATION LANGUAGES; DISTRIBUTED PARAMETER NETWORKS; DISTRIBUTION OF GOODS; ELECTRIC CONVERTERS; ELECTRIC LINES; ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER DISTRIBUTION; ELECTROMAGNETIC FIELDS; ELECTRONIC EQUIPMENT MANUFACTURE; LIGHT TRANSMISSION; OPERATIONS RESEARCH; PHOTOLITHOGRAPHY; STRIP TELECOMMUNICATION LINES; TRANSIENT ANALYSIS;

MODAL ANALYSIS;

EID: 69749111224     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2009.2022543     Document Type: Article

References (18)

1. M. Leone, "The radiation of a rectangular power-bus structure at multiple cavity-mode resonances," IEEE Trans. Electromagn. Compat. vol. 45, no. 3, pp. 486-492, Aug. 2003.
2. A. Abhari, G. V. Eleftheriades, and E. van Deventer-Perkins, "Physics-based CAD models for the analysis of vias in parallel-plate environments," IEEE Trans. Microw. Theory Tech., vol. 49, no. 10, pp. 1697-1707, Oct. 2001.
3. H. Liaw and H. Merkelo, "Simulation and modeling of mode conversion at vias in multilayer interconnections," in Proc. 45th Electron. Compon. Technol. Conf., 1995, pp. 361-367.
4. J. Fang, Y. Chen, Z. Wu, and D. Xue, "Model of interaction between signal vias and metal planes in electronic packaging," in Proc. Electr. Perform. Electron. Packag., 1994, pp. 211-214.
5. A. E. Ruehli, "Equivalent circuit models for three-dimensional multiconductor systems," IEEE Trans Microw. Theory Tech., vol. MTT-22, no. 3, pp. 216-221, Mar. 1974.
6. A. E. Engin, K. Bharath, M. Swaminathan, M. Cases, B. Mutnury, N. Pham, D. N. de Araujo, and E. Matoglu, "Finite- difference modeling of noise coupling between power/ground planes in multilayered packages and boards," in Proc. 56th Electron. Compon. Technol. Conf., 2006, pp. 1262-1267.
7. X. C. Wei, E.-P. Li, E.-X. Liu, and X. Cui, "Efficient modeling of re-routed return currents in multilayered power-ground planes by using integral equation," IEEE Trans. Electromagn. Compat., vol. 50, no. 3, pp. 740-743, Aug. 2008.
8. Z. Z. Oo, E.-X. Liu, E.-P. Li, X. C. Wei, Y-J. Zhang, M. Tan, L.-W. Li, and R. Vahldieck, "A senti-analytical approach for system-level electrical modeling of electronic packages with large number of vias," IEEE Trans. Adv. Packag., vol. 31, no. 2, pp. 267-274, May 2008.
9. E.-X. Liu, X. C. Wei, Z. Z. Oo, E.-P. Li, and L.-W. Li, "Modeling of advanced multilayered packages with multiple vias and finite groundplanes," in Proc. Electr. Perform. Electron. Packag., 2007, pp. 275-278.
10. C. R. Paul, "Decoupling the multiconductor transmission line equations," IEEE Trans. Microw. Theory Tech., vol. 44, no. 8, pp. 1429-1440, Aug. 1996.
11. Y. J. Zhang, J. Fan, G. Seli, M. Cocchim, and D. P. Francesco, "Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages," IEEE Trans. Microw. Theory Tech., vol. 56, no. 9, 2008.
12. L. Tsang, J. A. Kong, K. H. Ding, and C. O. Ao, Scattering of Electromagnetic Waves: Numerical Simulations. New York: Wiley-Interscience, 2001.
13. Wang, R. F. Harrington, and J. R. Mautz, "Quasi-static analysis of a microstrip via through a hole in a ground plane," IEEE Trans. Microw. Theory Tech., vol. 36, no. 6, pp. 1008-1013, Jun. 1988.
14. E.-P. Li, E.-X. Liu, L.-W. Li, and M.-S. Leong, "A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects," IEEE Trans. Adv. Packag., vol. 27, no. 1, pp. 213-223, Feb. 2004.
15. S. Chun, M. Swaminatham, L. Smith, J. Zhang, and M. Iyer, "Modeling to hardware correlation for power distribution induced I/O noise in a functioning computer system," in Proc. 52nd Electron. Compon. Technol. Conf., 2002, pp. 319-324.
16. J. S. Pak and J. Kim, "3 GHz through-hole signal via model considering power/ground plane resonance coupling and via neck effect," in Proc. 53rd Electron. Compon. Technol. Conf., 2003, pp. 1017-1022.
17. W. L. Yuan and E. P. Li, "A Systematic coupled approach for susceptibility analysis of a shielded device with multilayer circuitry," IEEE Trans. Electromagn. Compat., vol. 47, no. 4, pp. 692-700, Nov. 2005.
18. Z. Z. Oo, E.-X. Liu, X. C. Wei, and E.-P. Li, "An efficient algorithm for analysis of power integrity in electronic packages," in Proc. 2008 Asia-Pacific Symp. Electromagn. Compat. 19th Int. Zurich Symp. Electromagn. Compat., May, pp. 938-941.