Modeling of advanced multilayered packages with multiple vias and finite ground planes

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2007, Pages 275-278

  Liu, En Xiao ^a   Wei, Xingchang ^a   Oo, Zaw Zaw ^a,b   Li, Er Ping ^a,b   Li, Le Wei ^b  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC PULSE; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; ENERGY ABSORPTION; PHOTOLITHOGRAPHY; SURFACE MOUNT TECHNOLOGY;

ADVANCED ELECTRONIC PACKAGES; AT SYSTEMS; DENSELY POPULATED; EMI ANALYSES; FINITE GROUND EFFECTS; FINITE GROUND PLANES; MODELING APPROACHES; MULTILAYERED PACKAGES; MULTIPLE VIAS; POWER INTEGRITIES;

METHOD OF MOMENTS;

EID: 47949129037     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2007.4387180     Document Type: Conference Paper

References (8)

1. Z. Z. Oo, E.-X. Liu, E.-P. Li, X. Wei, Y. Zhang, M. T. Y. Choon, and L.-W. LI, "A Systematic Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages," IEEE Trans. Adv. Packag., submitted (May 2007).
2. Z. Z. Oo, E.-X. Liu, X. Wei, M T. Y. Choon, E.-P. Li, Y. Zhang, and L.-W. Li, "Hybrid of Scattering Matrix Method and Integral Equation used for Co-simulation of Power Integrity and EMI in Electronic Package with Large Number of P/G Vias," in Proc. 57th Electronic Components and Technology Conference (ECTC 2007), NV, USA, May 2007, pp. 815-820.
3. X. C. Wei, E. X. Liu, Z. Z. Oo, E. P. Li, and R. Vahldieck, "A Novel Approach for System Level Package Modeling to Address Signal and Power Integrity Issues," in Proc. 57th Electronic Components and Technology Conference (ECTC 2007), NV, USA, May 2007, pp. 1653-1658.
4. H. Chen, Q. Li, L. Tsang, C.-C. Huang, and V. Jandhyala, "Analysis of a large number of vias and differential signaling in multilayered structures," IEEE Trans. Microwave Theory Tech., vol. 51, pp. 818-829, 2003.
5. M. B. Bazdar, A. R. Djordjevic, R. F. Harrington, and T. K. Sarkar, "Evaluation of quasi-static matrix parameters for multiconductor transmission lines using Galerkin's method," IEEE Trans. Microwave Theory Tech., vol. 42, pp. 1223-1228, 1994.
6. E.-P. Li, E.-X. Liu, L.-W. Li, and M.-S. Leong, "A coupled efficient and systematic full-wave time-domain macromodeling and circuit Simulation method for signal integrity analysis of high-speed interconnects," Advanced Packaging, IEEE Transactions on, vol. 27, pp. 213-223, 2004.
7. L. Tsang, J. A. Kong, K. H. Ding, and C. Ao, Scattering of electromagnetic waves: numerical simulations. New York, Wiley Interscience, 2001.
8. A. C. Balanis, Advanced engineering electromagnetics. New York: Wiley, 1989.