A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films

Thin Solid Films

Volumn 518, Issue 1, 2009, Pages 247-256

  Matoy, Kurt ^a,b   Schönherr, Helmut ^c   Detzel, Thomas ^c   Schöberl, Thomas ^b   Pippan, Reinhard ^b   Motz, Christian ^b   Dehm, Gerhard ^b,d  

^a Kompetenzzentrum Automobil und Industrie Elektronik Gmbh   (Austria)

^b ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

^c INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

^d UNIVERSITY OF LEOBEN   (Austria)

Author keywords

Fracture stress; Micro cantilever; Silicon nitride; Silicon oxide; Silicon oxynitride; Toughness

Indexed keywords

CHEMICAL VAPOR DEPOSITED; COMPREHENSIVE STUDIES; DIELECTRIC THIN FILMS; FRACTURE BEHAVIOR; FRACTURE STRESS; FRACTURE TOUGHNESS VALUES; MEASUREMENT ACCURACY; MECHANICAL BEHAVIOR; MICRO-CANTILEVER; MICRO-CANTILEVERS; NANO-INDENTATION MEASUREMENTS; NITRIDE THIN FILMS; OXYNITRIDES; PASSIVATION FILM; REPRODUCIBILITIES; SILICON OXYNITRIDE; SILICON-BASED; YOUNG'S MODULUS;

ATOMIC FORCE MICROSCOPY; FRACTURE; GLASS FIBERS; MECHANICAL ENGINEERING; NANOCANTILEVERS; NANOINDENTATION; OXIDE FILMS; PASSIVATION; SEMICONDUCTING SILICON COMPOUNDS; SILICON NITRIDE; SILICON OXIDES; THIN FILMS; YIELD STRESS;

FRACTURE TOUGHNESS;

EID: 69649101809     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.07.143     Document Type: Article

References (42)

1. Handbook of Multilevel Metallization for Integrated Circuits (1993), Noyes Publications, New Jersey
2. Freund L.B., and Suresh S. Thin Film Mater. (2003), Cambridge University Press, Cambridge
3. Huang M., Suo Z., and Ma Q. J. Mech. Phys. Solids 50 (2002) 1079
4. Marsh D.M. Proc. R. Soc., A 279 (1964) 420
5. Marsh D.M. Proc. R. Soc., A 282 (1964) 33
6. Kiener D., Grosinger W., Dehm G., and Pippan R. Acta Mater. 56 (2008) 580
7. Tsuchiya T., and Inoue A. J. Sakata, Sens. Actuators, A, Phys. 82 (2000) 286
8. Sundararajan S., Bhushan B., Namazu T., and Isono Y. Ultramicroscopy 91 (2002) 111
9. Namazu T., and Iosono Y. Sens. Actuators, A, Phys. 104 (2003) 78
10. Oliver W.C., and Pharr G.M. J. Mater. Res. 7 (1992) 1564
11. Lawn B.R., Evans A.G., and Marshall D.B. J. Am. Ceram. Soc. 63 (1980) 574
12. Anstis G.R., Chantikul P., Lawn B.R., and Marshall D.B. J. Am. Ceram. Soc. 64 (1981) 533
13. Pharr G.M. Mater. Sci. Eng. A 253 (1998) 151
14. Uchic M.D., Dimiduk D.M., Florando J.N., and Nix W.D. Science 305 (2004) 986
15. Motz C., Schöberl T., and Pippan R. Acta Mater. 53 (2005) 4269
16. Weihs T.P., Hong S., Bravman J.C., and Nix W.D. J. Mater. Res. 3 (1988) 931
17. Johansson S., Schweitz J.-A., Tenerez L., and Tiren J. J. Appl. Phys. 83 (1988) 4799
18. Florando J.N., and Nix W.D. J. Mech. Phys. Solids 53 (2005) 619
19. Srikar V.T., and Spearing S.M. Exp. Mech. 43 (2003) 238
20. Kraft O., and Volkert C. Adv. Eng. Mater. 3 (2001) 99
21. Dehm G., Motz C., Scheu C., Clemens H., Mayrhofer P.H., and Mitterer C. Adv. Eng. Mater. 8 (2006) 1033
22. Di Maio D., and Roberts S.G. J. Mater. Res. 20 (2005) 299
23. In: Tesmer J.R., and M.N. (Eds). Handbook of Modern Ion Beam Materials Analysis (1995), Materials Research Society, Pittsburgh
24. Tirira J., Serruys Y., and Trocellier P. Forward Recoil Spectrometry (1996), Plenum Press, New York London
25. Lucovsky G., Lin S.Y., Richard P.D., Chao S.S., Takagi Y., Pai P., Keem J.E., and Tyler J.E. J. Non-Cryst. Solids 75 (1985) 429
26. Schliwinski H.-J., Schnakenberg U., Windbracke W., Neff H., and Lange P. J. Electrochem. Soc. 139 (1992) 1730
27. Alayo M.I., Pereyra I., Scopel W.L., and Fantini M.C.A. Thin Solid Films 402 (2002) 154
28. Claassen W.A.P., Pol H.A.J.T.v.d., Goemans A.H., and Kuiper A.E.T. J. Electrochem. Soc. 133 (1986) 1458
29. Bustarret E., Bensouda M., Habrard M.C., Bruyere J.C., Poulin S., and Gujrathi S.C. Phys. Rev. B Condens. Matter Mater. Phys. 38 (1988) 8171
30. Petersen K.E. Proc. IEEE 70 (1982) 420
31. Courtney T.H. Mechanical Behavior of Materials (2000), McGraw-Hill, Boston
32. Mencik J., and Quandt E. J. Mater. Res. 14 (1999) 2152
33. Picard D., Leguillon D., and Putot C. J. Eur. Ceram. Soc. 26 (2006) 1421
34. Wiederhorn S.M. J. Am. Ceram. Soc. 52 (1969) 99
35. Anderson T.L. Fract. Mech. (1995), CRC Press, Boca Raton, Fla
36. Lucas J.P., Moody N.R., Robinson S.L., Hanrock J., and Hwang R.Q. Scr. Metall. 32 (1995) 743
37. Lawn B. Fracture of brittle solids (1995), Cambridge University Press, Cambridge
38. Kurkjian C.R., Gupta P.K., Brow R.K., and Lower N. J. Non-Cryst. Solids 316 (2003) 114
39. Sokolov A.P., Kisliuk A., Soltwisch M., and Quitmann D. Phys. Rev. Lett. 69 (1992) 1540
40. Schuh C.A., Hufnagel T.C., and Ramamurty U. Acta Mater. 55 (2007) 4067
41. Cao Z., and Zhang X. Thin Solid Films 516 (2008) 1941
42. Bartenev G.M., and Sanditov D.S. J. Non-Cryst. Solids. 48 (1982) 405