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Volumn 6, Issue SUPPL. 2, 2009, Pages

GaN-on-Si HEMT stress under high electric field condition

Author keywords

[No Author keywords available]

Indexed keywords

DEGRADATION MECHANISM; DRAIN LEAKAGE CURRENT; DRAIN VOLTAGE; FAILURE MECHANISM; FIELD PLATES; GATE TECHNOLOGY; HIGH CURRENTS; HIGH ELECTRIC FIELDS; HIGH VOLTAGE; IN-SITU; LONG TERM; PRODUCTION COST; T-SHAPED GATE; VOLTAGE CAPABILITY;

EID: 69249236461     PISSN: 18626351     EISSN: 16101642     Source Type: Journal    
DOI: 10.1002/pssc.200880885     Document Type: Article
Times cited : (16)

References (19)
  • 9
    • 79251626005 scopus 로고    scopus 로고
    • (this conference)
    • F. Medjdoub et al., Proc. IWN 2008 (this conference).
    • (2008) Proc. IWN
    • Medjdoub, F.1
  • 15
  • 16
    • 0001668519 scopus 로고    scopus 로고
    • E. J. Miller et al., J. Appl. Phys. 88(10), 5951-5958 (2000).
    • (2000) J. Appl. Phys , vol.88 , Issue.10 , pp. 5951-5958
    • Miller, E.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.