|
Volumn 6, Issue SUPPL. 2, 2009, Pages
|
GaN-on-Si HEMT stress under high electric field condition
|
Author keywords
[No Author keywords available]
|
Indexed keywords
DEGRADATION MECHANISM;
DRAIN LEAKAGE CURRENT;
DRAIN VOLTAGE;
FAILURE MECHANISM;
FIELD PLATES;
GATE TECHNOLOGY;
HIGH CURRENTS;
HIGH ELECTRIC FIELDS;
HIGH VOLTAGE;
IN-SITU;
LONG TERM;
PRODUCTION COST;
T-SHAPED GATE;
VOLTAGE CAPABILITY;
DEGRADATION;
DRAIN CURRENT;
ELECTRIC FIELDS;
ELECTRON MOBILITY;
GALLIUM ALLOYS;
GALLIUM NITRIDE;
LEAKAGE CURRENTS;
SILICON;
HIGH ELECTRON MOBILITY TRANSISTORS;
|
EID: 69249236461
PISSN: 18626351
EISSN: 16101642
Source Type: Journal
DOI: 10.1002/pssc.200880885 Document Type: Article |
Times cited : (16)
|
References (19)
|