Magnetic microscopy for 3D devices: Defect localization with high resolution and long working distance on complex system in package

Microelectronics Reliability

Volumn 49, Issue 9-11, 2009, Pages 1169-1174

  Infante, F ^a   Perdu, P ^a   Lewis, D ^b  

^a CNES   (France)

^b UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

3D ARCHITECTURES; COMPLEX SYSTEMS; DEFECT LOCALIZATIONS; HIGH RESOLUTION; MAGNETIC MICROSCOPY; MICROELECTRONIC TECHNOLOGIES; MOORE'S LAW; NEW APPROACHES; SIMULATION APPROACH; THREE DIMENSIONAL GEOMETRY; WORKING DISTANCES;

MAGNETIC FIELDS; QUALITY ASSURANCE; SAFETY FACTOR; THREE DIMENSIONAL;

FAILURE ANALYSIS;

EID: 69249220106     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.06.041     Document Type: Article

References (10)

1. Knauss L.A., Cawthorne A.B., Lettsome N., Kelly S., Chatrephorn S., Fleet E.F., et al. Scanning SQUID microscopy for current imaging. Microelectron Reliab 41 February (2001) 1211-1229
2. Knauss LA, Frazier BM, Christen HM, Silliman SD, Harshavardhan KS, Fleet EF, et al. Detecting power shorts from front and backside of IC packages using scanning SQUID microscopy. In: Proceedings of 25th ISTFA; 1999. p. 11-6.
3. Knauss LA, Orozco A, Woods SI, Zhiyong Wang. Advances in magnetic-based current imaging for high resistance defects and sub-micron resolution. In: Proceedings of 11th IPFA; 2004. p. 267-70.
4. Hsiung S, Tan KV, Komrowski AJ, Sullivan DJD, Gaudestad J, Orozco A, et al. Failure analysis on resistive opens with scanning SQUID microscopy. In: 42nd Annual international reliability physics symposium, IEEE; 2004. p. 611-2.
5. Al-sarawi S.F., Abbott D., and Franzon P.D. A review of 3-D packaging technology. IEEE Trans Comp Pack Manuf Tech Part B 2 1 (1998) 2-14
6. Chatraphorn S., Fleet E.F., Wellstood F.C., and Knauss L.A. Noise and spatial resolution in SQUID microscopy. IEEE Trans Appl Supercond 11 1 (2001) 234-237
7. Roth B.J., Sepulveda N.G., and Wikswo Jr. J.P. Using a magnetometer to image a two-dimensional current distribution. J Appl Phys 65 1 (1989) 361-372
8. Wikswo Jr. J.P. The magnetic inverse problem for NDE. In: Weinstock H. (Ed). SQUID sensors: fundamentals, fabrication and applications (1996), Kluwer Academic Publishers 629-695
9. Crepel O, Poirier P, Descamps P, Desplats R, Perdu P, Haller G, et al. Magnetic microscopy for ICs failure analysis: comparative case studies using SQUID, GMR and MTJ systems. In: Proceedings of 11th IPFA; 2004. p. 45-8.
10. Infante F, Perdu P, Petremont S, Lewis D. A new methodology for short circuit localization on integrated circuits using magnetic microscopy techniques coupled with simulations. In: Proceedings of 16th IPFA; 2009. p. 208-12.