Failure analysis on resistive opens with scanning SQUID microscopy

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2004, Pages 611-612

  Hsiung, S ^a   Tan, K V ^a   Komrowski, A J ^a   Sullivan, D J D ^a   Gaudestad, J ^b   Orozco, A ^b   Talanova, E ^b   Knauss, L A ^b  

^a AGERE SYSTEMS   (United States)

^b Neocera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

IMAGE DIFFERENCE ANALYSIS (IDA); MAGNETIC DENSITY IMAGES; RESISTANCE DEFECTS; WIRE BONDS;

ELECTRIC CURRENTS; ELECTRIC POTENTIAL; FAILURE ANALYSIS; FAST FOURIER TRANSFORMS; FLIP CHIP DEVICES; IMAGING TECHNIQUES; MAGNETIC FIELD EFFECTS; QUANTUM INTERFERENCE DEVICES; TIME DOMAIN ANALYSIS;

SQUIDS;

EID: 3042604389     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. th ISTFA, 2001, pp. 77-81
2. D. Vallett, Scanning SQUID Microscopy for die level fault isolation, Proceedings of 28th ISTFA, 2002, pp. 391-396
3. L.A. Knauss, B.M Frazier, et al., Detecting Power Shorts ... IC packages using Scanning SQUID Microscopy, Proceedings of 25th ISTFA, 1999, pp. 11-61
4. A.Orozco, Fault Isolation of High Resistance Defects using Comparative Magnetic Field Imaging, Proceedings of 29th ISTFA, 2003, pp. 9-13