A mechanical de-tethering technique for silicon MEMS etched with a DRIE process

Journal of Micromechanics and Microengineering

Volumn 19, Issue 5, 2009, Pages

  Heriban D ^a   Agnus, J ^a   Petrini, V ^b   Gauthier, M ^a  

^a CNRS   (France)

^b UNIVERSITÉ DE FRANCHE COMTÉ   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DIMENSIONAL RULES; DRIE PROCESS; FABRICATION PROCESS; MECHANICAL FORCE; MICRO ASSEMBLY; MICROELECTROMECHANICAL SYSTEMS; NEW SOLUTIONS; SILICON MEMS; SPECIAL MACHINE; WAFER DICING;

ELECTRONICS PACKAGING; MECHANICAL ENGINEERING; MEMS; MICROELECTROMECHANICAL DEVICES; SILICON WAFERS; TETHERLINES;

COMPOSITE MICROMECHANICS;

EID: 68249141867     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/5/055011     Document Type: Article

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