A new sacrificial layer process for the fabrication of micromechanical systems

Journal of Micromechanics and Microengineering

Volumn 7, Issue 3, 1997, Pages 128-130

  Cui, Zheng ^a   Lawes, Ron A ^a  

^a RUTHERFORD APPLETON LABORATORY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTROPLATING; INTEGRATED CIRCUIT MANUFACTURE; PHOTORESISTS;

PHOTORESIST SACRIFICIAL LAYER TECHNIQUE;

MICROELECTROMECHANICAL DEVICES;

EID: 0031221264     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/7/3/012     Document Type: Article

References (6)

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2. Burbaum C, Mohr J and Bley P 1991 Fabrication of capacitive acceleration sensors by the LIGA technique Sens. Actuators A 25-7 613
3. Frazier A B, Ahn C H and Allen MG 1994 Development of micromachined devices using polymide-based processes Sens. Actuators A 45 47
4. Maciossek A, Löchel B, Quenzer H, Wagner B, Shulze S and Noetzel J 1995 Galvanoplating and sacrificial layers for surface micromachining Microelectron. Eng. 27 503
5. Howe R 1988 Surface micromachining for microsensors and microactuators J. Vac. Sci. Technol. B 6 (6) 1809
6. Mehregany M, Gabriel K and Trimmer W 1988 Integrated fabrication of polysilicon mechanisms IEEE Trans. Electron Dev. V 35 (6) 719