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Volumn 54, Issue 5 PART 1, 2009, Pages 1816-1823

Selective Etching of Thick Si3N4, SiO2 and Si by Using CF4/O2 and C2F6 Gases with or without O2 or Ar Addition

Author keywords

Reactive ion etching; Selective etching; Si

Indexed keywords


EID: 68049144548     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.54.1816     Document Type: Article
Times cited : (36)

References (19)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.