Characterization and acoustic emission monitoring of AFM nanomachining

Journal of Micromechanics and Microengineering

Volumn 19, Issue 4, 2009, Pages

  Ahn, B W ^a   Lee, S H ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EMISSION MONITORING; AFM; AFM TIP; CHIP FORMATIONS; COUNT RATES; CUTTING MODE; DEFORMATION CHARACTERISTICS; EXPERIMENTAL SETUP; FRICTION COEFFICIENTS; GEOMETRIC MODELS; GROOVE DEPTH; IN-PROCESS MONITORING; MACHINING CHARACTERISTICS; MODE TRANSITIONS; NANO SCALE; NANOMACHINING; NANOSCRATCHING; PILE-UP; PILE-UPS; SEM IMAGE;

ACOUSTIC EMISSION TESTING; ACOUSTIC EMISSIONS; ACOUSTICS; DEFORMATION; FRICTION; INSTRUMENT SCALES; MACHINING; PHOTORESISTS; PILES; PROCESS MONITORING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

ATOMIC FORCE MICROSCOPY;

EID: 67849086934     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/4/045028     Document Type: Article

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