Multi-sensor monitoring system in chemical mechanical planarization (CMP) for correlations with process issues

CIRP Annals - Manufacturing Technology

Volumn 55, Issue 1, 2006, Pages 325-328

  Jeong, H ^a   Kim, H ^b   Lee, S ^c   Dornfeld, D ^c  

^a Pusan National University   (South Korea)

^b Research and Development Center   (South Korea)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

CMP; Monitoring; Sensor

Indexed keywords

ACOUSTIC EMISSIONS; HALL EFFECT; PIEZOELECTRIC DEVICES; SENSORS;

CHEMICAL MECHANICAL PLANARIZATION (CMP); FORCE TRANSDUCER; PROCESS MONITORING;

CHEMICAL MECHANICAL POLISHING;

EID: 33750039389     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60427-2     Document Type: Article

References (10)

1. Li, S.H., Miller, R., 2000, Chemical Mechanical Polishing in Silicon Processing, Academic Press, San Diego
2. th edition: 267-274
3. Yi, J., Xu, C.S., 2005, Broadband optical end-point detection for linear chemical-mechanical planarization (CMP) process using image matching technique, Mechatronics, 15: 271-290
4. Chan, D., Swedek, B., Wiswesser, A., Birang, M., 1998, Process Control and Monitoring with Laser Interferometry Based Endpoint Detection in Chemical Mechanical Planarization, IEEE/ASMC: 377-384
5. Kim, S.Y., Park, C.J., Seo, Y.J., 2005, Signal analysis of the end point detection method based on motor current, Microelectronic Engineering, 66: 472-479
6. Oliveira, J.F.G., Valente, C.M.O., 2004, Fast Grinding Process Control with AE Modulated Power Signals, Annals CIRP, 53/1: 267-270
7. Lee, Y., Chang, A.K., Dornfeld, D.A., 2002, Acoustic Emission Monitoring for the Diamond Machining of Oxygen-free High-conductivity Copper, J. Materials Processing Technology, 127: 199-205
8. Karpuschewski, B., Wehmeier, M., Inasaki, I., 2000, Grinding Monitoring System Based on Power and Acoustic Emission Sensors, Annals CIRP, 49/1: 235-240
9. Bhushan, B., 1999, Principles and Applications of Tribology, John Wiley & Sons, Inc, N.Y.: 586-591
10. Lee, D.E., Hwang, I, Valente, C.M.O., Oliveira, J.F.G., Dornfeld, D.A, 2005, Precision Manufacturing Process Monitoring with Acoustic Emission, Int. J. Machine Tools and Manufacture, 46: 176-188