Differences in heat exposure degradation of Sn alloy platings joined with Ag-epoxy conductive adhesive

Journal of Materials Science

Volumn 41, Issue 2, 2006, Pages 583-585

  Yamashita, Munenori ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRODES; PLATING; SCANNING ELECTRON MICROSCOPY; TENSILE TESTING; X RAY DIFFRACTION;

AG-EPOXY CONDUCTIVE ADHESIVE; CROSSHEAD SPEED; HEAT EXPOSURE;

TIN ALLOYS;

EID: 33644515989     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-2155-9     Document Type: Article

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