Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology

German Microwave Conference, GeMIC 2009

Volumn , Issue , 2009, Pages

  Richter, Marius D ^a   Becker, Karl F ^b   Bottcher, Lars ^b   Schneider, Martin ^a  

^a UNIVERSITY OF BREMEN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPLANAR LINES; MICROVIAS; SIMULATION AND MEASUREMENT; SYSTEM-IN-PACKAGE TECHNOLOGY;

CELLULAR RADIO SYSTEMS; MICROWAVE CIRCUITS; MICROWAVES; PRINTED CIRCUIT MANUFACTURE; SYSTEMS ANALYSIS;

PRINTED CIRCUIT BOARDS;

EID: 67650145728     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/GEMIC.2009.4815915     Document Type: Conference Paper

References (10)

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