Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology

Proceedings of the 38th European Microwave Conference, EuMC 2008

Volumn , Issue , 2008, Pages 1573-1576

  Richter, Marius D ^a   Becker, Karl F ^b   Böttcher, Lars ^b   Schneider, Martin ^a  

^a UNIVERSITY OF BREMEN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR RADIO SYSTEMS; MICROWAVE CIRCUITS;

HIGH FREQUENCIES; MICROVIA; SIMULATION AND MEASUREMENTS; SYSTEM-IN-PACKAGE TECHNOLOGIES;

MICROWAVES;

EID: 62349119298     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2008.4751770     Document Type: Conference Paper

References (9)

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9. B. Keser et al., "Advanced packaging: The redistributed chip package," IEEE Trans. Adv. Packag., vol. 31, pp. 39-43, Feb. 2008.