Realization of a stackable package using chip in polymer technology

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002 - Conference Proceedings

Volumn , Issue , 2002, Pages 160-164

  Ostmann, A ^b   Neumann, A ^a   Weser, S ^b   Jung, E ^b   Bottcher L ^b   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; INTEGRATION; MICROELECTRONICS; PHOTONICS; POLYMERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; SIGNAL PROCESSING;

ACTIVE COMPONENTS; CHIP SIZE PACKAGE; DIGITAL APPLICATIONS; ORGANIC SUBSTRATE; PACKAGING TECHNOLOGIES; PORTABLE PRODUCTS; SIGNAL FREQUENCIES; SPACE REQUIREMENTS;

CHIP SCALE PACKAGES;

EID: 84962234558     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2002.1020202     Document Type: Conference Paper

References (8)

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