Flip chip design of dual band/tri mode SiGe BiCMOS transmitter IC for CDMA wireless applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2003, Pages 1547-1550

  Megahed, Mohamed ^a   Van Gieson, Frank ^a   Reddy, Madhukar ^a   Yates, David ^a  

^a SKYWORKS SOLUTIONS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; CODE DIVISION MULTIPLE ACCESS; FLIP CHIP DEVICES; SPURIOUS SIGNAL NOISE; TRANSMITTERS;

SIGNAL PATHS;

WIRELESS TELECOMMUNICATION SYSTEMS;

EID: 0043093767     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. T. Nishino et al., "Suppression of Multipath Couplings in MCM with a Flip-Chipped SiGe MMIC," in IEEE MTT-S Symp. Dig. Seattle, WA, pp. 1385 - 1388, June 2002.
2. M. Reddy et al., "Highly integrated Dual Band/tri-mode SiGe BiCMOS transmitter IC for CDMA Wireless Applications," in IEEE RFIC Symp. Dig. Seattle, WA, pp. 35 - 38, June 2002.