Duromer MID technology for system-in-package generation

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 4, 2005, Pages 291-296

  Becker, Karl F ^a   Braun, Tanja ^a   Neumann, Alexander ^a   Ostmann, Andreas ^a   Koch, M ^a   Bader, V ^a   Aschenbrenner, Rolf ^a   Reichl, Herbert ^a   Jung, Erik ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Duromer molded interconnect device (MID); Encapsulation; Laser structuring; Metallization; Nano enhanced materials; System in package (SiP); Three dimensional (3 D) packaging; Wafer level packaging

Indexed keywords

COST EFFECTIVENESS; ENCAPSULATION; EPOXY RESINS; METALLIZING; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; NANOSTRUCTURED MATERIALS; PLASTICS MOLDING; THERMAL EFFECTS; THERMAL EXPANSION; THERMOPLASTICS; THREE DIMENSIONAL;

DUROMER MOLDED INTERCONNECT DEVICE (MID); LASER STRUCTURING; NANOENHANCED MATERIALS; SYSTEM-IN-PACKAGE (SIP); THREE DIMENSIONAL (3D) PACKAGING; WAFER LEVEL PACKAGING;

CHIP SCALE PACKAGES;

EID: 27844608952     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.856537     Document Type: Article

References (8)

1. K.-F. Becker, T. Braun, A. Neumann, A. Ostmann, M. Koch, V. Bader, R. Aschenbrenner, and H. Reichl, "A new wafer level packaging approach: encapsulation, metallization, and laser structuring for advanced system in package manufacturing," in Proc. Polytronic, Montreux, Switzerland, 2003, pp. 225-230. 21.-23.10.2003.
2. K.-F. Becker, E. Jung, A. Ostmann, T. Braun, A. Neumann, R. Aschenbrenner, and H. Reichl, "Stackable system-on-packages with integrated components," IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 268-277, May 2004.
3. T. Braun, K.-F. Becker, M. Koch, V. Bader, R. Aschenbrenner, and H. Reichl, "High temperature potential of flip chip assemblies," in Proc. HITEC, Santa Fe, NM, 2004, pp. 376-383.
4. T. Braun, K.-F. Becker, M. Koch, V. Bader, R. Aschenbrenner, and H., Reichl, "Flip chip molding - recent progress in flip chip encapsulation," in Proc. IEEE 8th Int. Symp. Advanced Packaging Materials, Stone Mountain, GA, 2002, pp. 151-159. 3.-6.03.2002.
5. L. Boettcher, C. Dombrowski, A. Ostmann, and H. Reichl, "Wafer-level redistribution using fully-additive Cu/Ni/Au metallization," in Proc. SMTA, Chicago, IL, 2002, pp. 356-363.
6. K. Zoschke, J. Wolf, M. Töpper, O. Ehrmann, T. Fritsch, K. Scherpinski, F.-J. Schmückle, and H. Reichl, "Thin film integration of passives - single components, filters, integrated passive devices," in Proc. 54th ECTC Conf., 2004, pp. 294-301.
7. L. Boettcher, A. Ostmann, R. Vieroth, and H. Reichl, "Electroless wafer-level redistribution - further development and new approaches for system integration," in Proc. SMTA, Chicago, IL, 2003, pp. 267-274.
8. T. Braun, K.-F. Becker, M. Koch, V. Bader, U. Oestermann, D. Manessis, R. Aschenbrenner, and H. Reichl, "Wafer level encapsulation - a transfer molding approach to system inpackage generation," in Proc. EPTC, Singapore, 2002, pp. 235-244.