Stackable system-on-packages with integrated components

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 2, 2004, Pages 268-277

  Becker, Karl F ^a   Jung, Erik ^a   Ostmann, Andreas ^a   Braun, Tanja ^a   Neumann, Alexander ^a   Aschenbrenner, Rolf ^a   Reichl, Herbert ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTROLESS PLATING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT TESTING; INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; NICKEL PLATING; PLASMA ETCHING; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY;

EMBEDDED PASSIVES; MODULAR SYSTEMS; MOLDED INTERCONNECT DEVICE; SYSTEM PACKAGING; WAFER LEVEL PACKAGING;

CHIP SCALE PACKAGES;

EID: 4544250897     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.828826     Document Type: Article

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