Advanced packaging: The redistributed chip package

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 1, 2008, Pages 39-43

  Keser, Beth ^a   Amrine, Craig ^a   Duong, Trung ^a   Hayes, Scott ^a   Leal, George ^a   Lytle, William ^a   Mitchell, Doug ^a   Wenzel, Robert ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Advanced packaging; Dielectric material; Electronic packaging; Redistribution

Indexed keywords

BALL GRID ARRAYS; COST REDUCTION; DIELECTRIC MATERIALS; EMBEDDED SYSTEMS; ENCAPSULATION; FLIP CHIP DEVICES;

ADVANCED PACKAGING; REDISTRIBUTED CHIP PACKAGE; WAFER BUMPING;

ELECTRONICS PACKAGING;

EID: 40549125348     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.909456     Document Type: Article

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