Interface structure of ultrasonic wedge bonding joints of Ni/Al

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 15, Issue 4, 2005, Pages 846-850

  Li, Jun Hui ^a   Han, Lei ^a   Zhong, Jue ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Electronics packaging; Microstructure; Ni Al; Ultrasonic; Wedge bonding

Indexed keywords

ADHESIVE JOINTS; ALUMINUM; COPPER; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); MICROSTRUCTURE; NICKEL; PIEZOELECTRIC TRANSDUCERS; SCANNING ELECTRON MICROSCOPY; ULTRASONIC WELDING;

BONDING JOINTS; DIGITAL OSCILLOSCOPE; ULTRASONIC BONDING; WEDGE BONDING;

BONDING;

EID: 25844469178     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)

1. Tsujino J, Yoshihara H, Kamimoto K, et al. Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding[J]. Ultrasonics, 2002, 36(2): 59-65.
2. Harman G G. Wire Bonding in Microelectronics (2nd edition)[M]. New York: McGraw-Hill Publishing House, 1997. 18-23.
3. Harman G G. Wire bonding to advanced copper, low-K integrated circuits, the metal/dielectric stacks, and materials considerations[J]. IEEE Trans Parts Hybrids Manuf Technol, 1990 (13): 176-181.
4. LI Jun-Hui, HAN Lei, ZHONG Jue. Microstructure characteristics at the thermosonic bond interface[J]. China Mechanical Engineering, 2005, 16(4): 341-344.
5. Suman S, Gaitan M, Joshi Y, et al. Wire bond temperature sensor[J]. Georgia Institute of Technology, 2002, 1(1): 1-6.
6. Schwizer J, Mayer M, Bolliger D, et al. Thermosonic ball bonding: friction model based on integrated microsensor measurements[A]. The 25th IEEE/CPMT International Electronic Manufacturing Technology Symposium IEMT[C]. Austin, Texas, 1999. 108-114.
7. Ivy W Q, Paul B, Dave D. Wedge bonding for ultra fine pitch applications[J]. Kulicke and Soffa, 2003, 2(1): A1-A10.
8. Elenius P, Levine L. Comparing flip-chip and wire-bond interconnection technologies[J]. Chip Scale Review, 2000, 8: 81-87.
9. Kang S Y, Williams P M, Mclaren T S, et al. Studies of thermosonic bonding for flip-chip assembly[J]. Materials Chemistry and Physics, 1995, 42: 31-37.
10. WANG Chang-hai, Holmes A S. Laser-assisted bumping for flip chip assembly[J]. IEEE Transaction on Electronics Packaging Manufacturing, 2001, 24(2): 109-114.
11. TAN Qing, Schaible B, Leonard J, et al. Thermosonic flip chip with a self-planarization feature using polymer[J]. IEEE Transaction on Components, Hybrids, and Manufacturing Technology, 1998, 32(5): 1-8.
12. Snitka V, Ulcinas A, Rackaitis M, et al. Ultrasonic surface vibration investigation by atomic force microscopy[J]. Ultrasonic, 1998, 36: 499-503.
13. GAO Wei-lou, Tittmann B R, Miyasaka C. Contrast mechanism of ultrasonic atomic force microscopy[J]. IEEE Ultrasonics Symposium, 1999, 24(6): 601-604.
14. Krzazowski J E. A transmission electron microscopy study of ultrasonic wire bonding[J]. IEEE Transaction on Components, Hybrids, and Manufacturing Technology, 1995, 13(1): 176-182.
15. TAN Chen Ming, GAN Zheng-hao. Failure mechanisms of aluminum bond pad peeling during thermosonic bonding[J]. IEEE Transactions on Device and Materials Reliability, 2003, 3(2): 44-50.
16. Quan Q, Giles J B. Mechanism of removal of micronsized particles by high-frequency ultrasonic waves[J]. IEEE Transaction on Ultrasonics, Perroelectrics, and Frequency Control, 1995, 42(4): 619-629.